Die attachment
This article is licensed under the GNU Free Documentation License. It uses material from the Wikipedia article "Die_attachment".

Die attachment process (Photo by Creative Materials Inc.)

Die attachment is the step during the integrated circuit packaging phase of semiconductor device fabrication during which a die is mounted and fixed to the package or support structure.

For high-powered applications, the die is usually eutectic bonded onto the package (for good heat conduction). For low-cost, low-powered applications, the die is often glued directly onto a substrate (such as a printed wiring board) using an epoxy adhesive.

External links

• Related machines for die attach
• Oerlikon Esec, global provider of chip assembly equipment and system solutions for the semiconductor industry

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